PACKAGE STRUCTURE

A package structure includes a leadframe, at least two dies, at least one spacer and a plastic package material. The leadframe includes a die pad. The dies are disposed on the die pad of the leadframe. The spacer is disposed between at least one of the dies and the die pad. The plastic package material is disposed on the leadframe, and covers the dies. A first minimum edge distance is located between one of a plurality of edges of the spacer and one of a plurality of edges of the die pad, a second minimum edge distance is located between one of a plurality of edges of the dies and one of the edges of the die pad, and the first minimum edge distance is larger than the second minimum edge distance. Therefore, a risk of the delamination of the plastic package material during the package structure stressed can be reduced, wherein the flexibility of design of the package structure can be increased via the spacer, and the spacer can be configured to protect the dies to prevent the damage.一種封裝結構，其包含一導線架、至少二晶片、至少一間隔層及一塑膠封裝材料。導線架包含一晶片座。晶片設置於導線架的晶片座上。間隔層設置於晶片的至少一者與晶片座之間。塑膠封裝材料設置於導線架上，並覆蓋晶片。間隔層的複數邊緣中的一者與晶片座的複數邊緣中的一者之間具有一***小邊距，晶片的複數邊緣中的一者與晶片座的邊緣中的一者之間具有一第二*小邊距，且***小邊距大於第二*小邊距。藉此，可降低封裝結構於受應力時塑膠封裝材料分層的風險，其中間隔層可增加封裝結構的設計彈性，且可用以保護晶片以避免受損。