Methods of electrochemical deposition for void-fre

作者：AKSU, SERDAR | LEE, JUNG-GU | SAKRY, BART | SHAVIV, ROEY

申请者：APPLIED MATERIALS INC.

发明人：AKSU, SERDAR | LEE, JUNG-GU | SAKRY, BART | SHAVIV, ROEY 年：2022,

语种：英语

公开国家：TW 国家：中国台湾

专利申请号：TW106143200 专利申请日期：2017-12-08

公开(公告)号：TWI756319B 公开日期：2022-03-01

优先权号：US201615380771 | 2016US-15380771

分类号：C25D 5/18 20060101AFI20220301VHTW 国际主分类号：C25D 5/18 20060101AFI20220301VHTW 国际分类号：C25D-5/18 | H01L-21/768 CPC分类号：C25D-007/123 | C25D-005/02 | C25D-005/08 | H01L-021/2885 | H01L-021/76877 | C25D-005/18 | C25D-003/38 | C25D-017/001 | C25D-005/611 | H01L-021/76876 | H01L-021/76837 | H01L-021/76873 | H01L-021/02263 | C25D-005/34

法律状态：GRANTED

摘要： 提供一種在具有至少一個次30奈米特徵結構的一工件上電鍍的方法。此方法包括：施加一**電解質化學品至此工件，**電解質化學品包括一金屬陽離子溶質物質及一抑制劑，金屬陽離子溶質物質具有約在50mM至約250mM的範圍內的濃度，抑制劑造成大於0.75伏特(V)的極化且在大於0.25伏特/秒(V/s)的速度時達到0.75V的極化;以及施加一電氣波形，其中此電氣波形包括一電流緩升的期間(period of ramping up of current)及一電流部分緩降的期間(period of partial ramping down of current)，其中電流部分緩降的期間在電流緩升的期間之後。 | A method of electroplating a workpiece having at least one secondary 30 nanometer feature is provided. The method comprises: applying a first electrolyte chemical to the workpiece, the first electrolyte chemical comprising a metal cation solute having a concentration in the range of about 50 mM to about 250 mM and an inhibitor, the inhibitor causing polarization greater than 0.75 volts (V) and reaching polarization of 0.75 V at a rate greater than 0.25 volts/second (V/s); And applying an electrical waveform, wherein the electrical waveform comprises a period of ramping up of current and a period of partial ramping down of current, wherein the period of partial ramping down is after the period of current ramping.