Resin composition, use of resin composition, adhes

作者：Noi Shintaro | TASHIRO TOMOJI | Kenta Mizuma | Qingguguang

申请者：AICA KOGYO CO., LTD.

发明人：Noi Shintaro | TASHIRO TOMOJI | Kenta Mizuma | Qingguguang 年：2022,

语种：英语

公开国家：TW 国家：中国台湾

专利申请号：TW110127919 专利申请日期：2021-07-29

公开(公告)号：TW202216891A 公开日期：2022-05-01

优先权号：JP2020129827 | 2020JP-0129827

分类号：C08L 53/02 20060101AFI20220501BHTW 国际主分类号：C08L 53/02 20060101AFI20220501BHTW 国际分类号：C08L-53/02 | B32B-7/12 | C08K-5/14 | C08L-71/12 | C09J-7/30 | C09J-11/06 | C09J-153/02 | C09J-171/12 | H05K-1/03 | H05K-3/38 CPC分类号：C08L-053/025 | C09J-153/025 | C09J-011/06 | C09J-007/10 | C09J-007/30 | B32B-027/302 | B32B-027/308 | B32B-027/285 | B32B-027/08 | B32B-009/00 | B32B-009/04 | B32B-009/045

法律状态：PENDING

摘要： 本發明提供一種電容率及損耗正切充分地低且在低彈性模數下的伸長率高的樹脂組成物及其用途，以及使用該樹脂組成物形成的接著片及積層板。樹脂組成物包含：包含苯乙烯及丁二烯的氫化嵌段共聚物(A);末端以(甲基)丙烯醯基改質的聚苯醚共聚物(C);及有機過氧化物(D)，(C)相對於上述樹脂組成物的總固體成分的調配量為8～45重量%。 | The present invention provides a resin composition having sufficiently low permittivity and loss tangent and high elongation at a low elastic modulus and a use thereof, and an adhesive sheet and a laminate formed by using the resin composition. The resin composition includes: a hydrogenated block copolymer (A) containing styrene and butadiene; a polyphenylene ether copolymer (C) modified with a (meth)acryloyl group at the end; and an organic peroxide (D). The compounding quantity of the polyphenylene ether copolymer (C) with respect to the total solid content of the said resin composition is 8% to 45% by weight.