Surface treatment apparatus and surface treatment

作者：yo male | JIN SHANYI

申请者：SEMES CO., LTD.

发明人：yo male | JIN SHANYI 年：2022,

语种：英语

公开国家：TW 国家：中国台湾

专利申请号：TW110139257 专利申请日期：2021-10-22

公开(公告)号：TW202216314A 公开日期：2022-05-01

优先权号：KR20200143563 | 2020KR-0143563

分类号：B08B 11/00 20060101AFI20220501BHTW 国际主分类号：B08B 11/00 20060101AFI20220501BHTW 国际分类号：B08B-11/00 | B08B-5/00 | H01L-21/67 CPC分类号：C23C-004/11 | C23C-004/134 | C23C-024/04 | C23C-024/08 | B08B-005/023 | H01L-021/67005 | B08B-005/043 | B08B-2205/00 | C23C-014/56 | C23C-014/021 | C23C-014/5873 | B05C-005/00 | B05C-005/02

法律状态：PENDING

摘要： 本發明構思提供一種用於處理待處理的物件之表面的方法，其中設置在一設備中且經污染以用於處理一基材諸如晶圓的零件被用作待處理的物件。在一實施例中，前述表面處理方法包括：在其中設置有前述物件的一大氣中形成真空且藉由**粒子與前述物件之前述表面上的污染物之碰撞以超音速速率來清潔前述物件之前述表面。 The inventive concept provides a method for treating a surface of an object to be treated, in which a part provided and contaminated in an apparatus for treatment of a substrate such as a wafer serves as the object to be treated. In an embodiment, the surface treatment method includes forming a vacuum in an atmosphere in which the object is provided and cleaning the surface of the object by collision of first particles with contaminants on the surface of the object at supersonic speed. | The inventive concept provides a method for treating a surface of an object to be treated, in which a part provided and contaminated in an apparatus for treatment of a substrate such as a wafer serves as the object to be treated. In an embodiment, the surface treatment method includes forming a vacuum in an atmosphere in which the object is provided and cleaning the surface of the object by collision of first particles with contaminants on the surface of the object at supersonic speed.